3D modeling of printed circuit boards & devices via CAD design
SYS TEC electronic uses state-of-the-art 3D CAD design software for mechanical and housing design. With the know-how of our development team your ideas take the optimal shape.
Our developments in the area of mechanical & housing design start with the planning and compilation of the mechanical boundary conditions.
Already at the beginning of the layout phase we examine the mechanical boundary conditions and carry out a comprehensive installation space analysis with consideration of possible bottlenecks. The subsequent collection of the housing data as well as designing of printed circuit boards and devices takes place by means of CAD design in a 3D modeling.
As a next step, we simulate and calculate the thermal design of the enclosure in the 3D CAD design. We thoroughly test the correctness of the calculations under real operating conditions in our in-house climate chamber.
Thanks to our pool of existing enclosure designs in a wide range of materials, shapes and sizes, we can also find the right solution for your requirements quickly and efficiently.
Your contact:
Your SYS TEC electronic sales team
